TOFD

Sonotron NDT 專注於研發、製造、行銷以及銷售獨特智慧型非破壞檢測（NDT）設備以及技術，主要用來做超音波、也用在MIA以及渦電流方面。對非破壞 檢測來說是一種突破。公司的產品顛覆了傳統非破壞檢測以及發現了更多的可能性 。詳細資料備索。

產品介紹 （用在 TOFD 檢測方面）
　

ISONIC 2006

Sonotron NDT Home Page

規格

脈衝型態:

正峰脈衝 / 正方波脈衝

Initial Transition:

≤5 ns (10-90%)

脈衝振幅:

尖峰脈衝- 在四階的激發能下可調變(18 階) 50V ...400 V 調成50 Ω
方波脈衝 -可調變(18 階)  50V ...400 V 調成50 Ω

脈衝持續時間:

尖峰脈衝- 50 Ω 載荷下10...70 ns ，要視電力以及阻抗的設定而定
方波脈衝 -  在5 ns的刻度內65...600 ns可調變(透過操縱脈衝的前端以及衍生端)

能量(尖峰脈衝):

4 不連續的能量值 / 在 400V振幅下0 μJ (最小)至 250 μJ (最大)

型式:

單一/雙重

阻抗:

17 不連續的阻抗值 / 最小值25Ω 至 最大值1000 Ω

內部匹配 線圈-探頭組抗匹配:

16 不連續的誘導率值/ 最小值2 μH 至最大值 78 μH

脈衝重複頻率:

0 -可選擇項目; 15...5000 Hz在1 Hz 解析度內可調變

可選的同步輸出/ 輸入:

最大 +5V, τ ≤ 5 ns, t ≥100 ns,負載阻抗 ≥50 Ω

增益:

0...120 dB ，在 0.5 dB 解析度內可調變

先進的低噪音設計:

93 μV 峰對峰輸入 ,80 dB 增益 / 35 MHz 頻寬

頻寬:

0.35...35 MHz 寬頻/ 34 次頻帶

超音波波速:

300...20000 m/s (11.81....787.4 "/ms) 在1 m/s (0.1 "/ms) 解析度內可調變

範圍:

0.5...3000 μs - 在 0.01 μs 解析度內可調變

顯示延時:

0...3200 μs - 在0.01 μs 解析度內可調變

探頭角度:

0-90°，在 1° 解析度內可調變

探頭延遲:

0 to 70 μs 在0.01μs 解析度內可調變-可擴充

顯示型式

射頻, 整流 (全波 / 負或正半波), 信號的頻譜 (快速傅立葉變換)

Reject:

0...99 % 屏蔽高度，在1% 解析度內可調變

DAC / TCG:

理論上，通過輸入 dB/公釐 (dB/") 因素
實驗上，透過對各種均等反射物位置回波振幅的連續紀錄
46 dB 動態範圍, 傾斜 ≤ 20 dB/μs, 容積 ≤40點
能用來做整流以及射頻 顯示

DGS:

標準實驗室配備用來做 18 探測/可以無限的擴充

Gates:

2 獨立的閘門 / 可以無限的擴充

Gate 開始以及寬度:

可以控制整個 A-Scan 顯示延時的變動以及在A-Scan 範圍 0.1 公釐 /// 0.001" 解析度內做設定

Gate Threshold:

55 % 的A-Scan 高度可以控制在 1 % 解析度內

測量功能-數位顯示讀出裝置:

27 種自動化方程式 / 解析度; 多層結構雙超音波波速量測模式; 彎曲表面/ 厚度 / 角光束探頭略過校正; 超音波波速以及各式探頭探頭遲延自動校正

暫停 (A-Scans以及光譜圖)

  • 全部暫停

  • 暫停峰值

  • 所有的信號以及頻譜評估功能、管理閘道以及增益設定都用得到暫停信號

編碼:

直線掃描:

  • Time-based (內嵌的即時時鐘-0.02 sec 解析度)

  • True-to-location (增加的編碼器 -0.5 公釐 解析度)

XY 掃描:

  • 非接觸式超音波 (如下所示)

非接觸式的超音波基礎編碼特性:

探頭操作區域

≤2000x3000 公釐
≤80x120 "

≤500x500 公釐
≤20x20 "

≤200x200 公釐
≤8x8 "

掃描表面的彎曲半徑

≥2000 公釐 / ≥40 "

≥200 公釐 / ≥8 "

≥37 公釐 / ≥1.5 "

掃描的速度

≤150 公釐/s
≤6 "/s

≤150 公釐/s
≤6 "/s

≤150 公釐/s
≤6 "/s

掃描索引

1到 20 公釐可調變

在1 公釐刻度內

1 至20 公釐可調變

在 1 公釐 刻度內

0.25 公釐; 0.5 公釐 或1 至20 公釐可調變

在1 公釐刻度內

探頭校正決定的解析度

≥1 公釐 / ≥0.04 "

≥1 公釐 / ≥0.04 "

≥0.25 公釐 / ≥0.01 "

用來決定探頭旋轉角的解析度

-

1°

0.5°

探頭可旋轉的範圍

-

±90°

±90°

對周遭噪音的忍受度

≤60 dB

≤60 dB

≤60 dB

耦合監控器:

連接螢幕內嵌的控制器以及介面，適合各種掃描速度最高可達到150 公釐 /秒 (6 in /sec); 解析度 -0.5 dB 的 超音波探頭。

測試功能健全的螢幕:

  • 掃描計畫的背景影像

  • 實際探頭軌跡的紀錄以及影像

  • 產生符合目前耦合程度、探頭位置以及掃描時選轉角度的可辨識的記號

  • 如果遺失耦合或是探頭未置或是掃描角度時，實際探頭軌跡的紀錄和影像會中斷

影像型式:

 B-Scan的斷層代表性的B-Scan, 平面檢視 CB-Scan, C-Scan, D-Scan, P-Scan, TOFD -依照作業選取的模式伴隨相符合的儀器設定。

影像特性:

檢查

角光束

直光束

測試下的寬度體積

5 到 300 公釐 在 1 公釐 內可調變解析度 -可擴充
0.2 到12 " 在 0.01 "內可調變 解析度-可擴充

50到2000 公釐  在1 公釐 內可調變解析度 -可擴充
0.2 到80 "在0.01 "內可調變 解析度 -可擴充

測試下的厚度體積

5 到 300 公釐 在 1 公釐 內可調變解析度 -可擴充
0.2到 12 " 在0.01 "內可調變 解析度-可擴充

0.5 到300 公釐在0.1 公釐 內可調變解析度 -可擴充
0.02 到12 "在0.01 "內可調變 解析度-可擴充

影像解析度

0.5 公釐 x 0.5 公釐 x 半掃描索引
0.02 in x 0.02 in x 半掃描索引

0.2 公釐 x 0.5 公釐 x 半掃描索引x
0.01 in x 0.02 in x 半掃描索引

標準的彩色色階 (調色盤)

  • Pseudo Color

  • 灰階

  • 色帶

  • Pseudo Color

  • 灰階

  • 色帶

使用者自訂色階 (調色盤)

≤232 色

≤232 色

信號振幅色調協議

  • 線性

  • TCG 標準化

  • DAC 標準化

  • DGS 標準化

  • 自訂

  • 線性

  • TCG 標準化

  • DAC 標準化

  • 自訂

單一直線掃描紀錄的長度:

50...20000 公釐 (2"-800"), 自動化的捲軸

記錄方式:

完全未處理過的資料紀錄

利用區域:

可控制整個顯示延時, 探頭延遲, 範圍, US Velocity 以及其他適當的儀器安裝

離線影像分析:

  • 在掃描時重新取得並且重放 A-Scan 捕捉的畫面

  • 迴波動態型態分析

  • 缺陷的尺寸以及輪廓

  • 厚度 /振幅 資料的統計分析

  • 把紀錄轉換成 ASCII/MS Excel®/MS Word® 形式

資料紀錄:

直接列印出Calibration Dumps, A-Scans, 光譜圖,  B-Scans斷層, 代表性的B-Scans,  平面檢視CB-Scans, TOFD 地圖, CB-Scans, C-Scans, D-Scans, P-Scans, TOFD 地圖

資料儲存能力:

  • 最少100000 sets包含 A-Scans 或是光譜圖的calibration dumps

  • 最少10000 sets 包含B-Scans斷層, 代表性的 B-Scans, 平面檢視 CB-Scans, TOFD 地圖, CB-Scans, C-Scans, D-Scans, P-Scans, 或是 TOFD 地圖 以及掃描時捕捉到的完全連續的A-Scans  calibration dumps

資料記錄器:

選項。建立以及管理資料檔案能夠儲存每個最多 254745 紀錄並且形成2維矩陣；在資料庫中每個紀錄包含 相對應未處理過的 A-Scan資料以及儀器設定的 厚度讀數

晶片處理器

Pentium M 300MHz

RAM:

128 Megabytes

Flash Memory - Quasi HDD

4 Gigabytes

輸出:

LAN, USB X 2, PS 2, SVGA

螢幕:

6.5" 高彩解析度 (32 位元) SVGA 640×480 像素 133×98 公釐 (5.24" ×3.86") Sun-readable LCD; 最大A-Scan 尺寸 (工作區域) -130×92 公釐 (5.12" × 3.62")

控制器:

前面面板封閉鍵盤, 前面面板密封滑鼠, 觸控螢幕

相容的外接裝置:

PS 2 鍵盤以及滑鼠, USB 鍵盤以及滑鼠, USB 快閃記憶卡,  USB或 LAN連印表機,  USB或LAN連接個人電腦, SVGA 外部螢幕顯示器

作業系統:

Windows™ 98SE -儀器操作
能夠連結網路以及用USB連接並且能夠在外部的個人電腦中(Windows™ 98SE, Windows™ 2000, Windows™ XP下)做離線資料分析以及出報告

電力:

最主要- 100...240 VAC, 40..70 Hz, 自動切換; 電池12V 8AH最高可持續作業六小時

外箱:

IP 53 可攜式堅固的鋁箱

體積:

265×156×121 公釐 (10.43"×6.14"×4.76") - 不含電池
265×156×159 公釐 (10.43"×6.14"×6.26") - 含電池

重量:

3.150 公斤(6.93 lbs) - 不含電池
4.280 公斤(9.42 lbs) - 含電池

傳統的脈衝回波以及穿透A掃描基礎檢測
Conventional pulse echo and through transmission A-Scan-based inspection

　
  • 640X480 pixels A-Scan display with physical dimensions 130 x 90 mm (5.12" x 3.62") of working area is largest one for the plurality of portable ultrasonic flaw detectors
  • Combined adjustable spike wave / square wave pulser equipped with variety of probe impedance matching coils provides optimal ultrasound penetration for various materials characterized either by high or low grain, sound attenuation, and the like
  • High frequency probe may not be destroyed occasionally upon connecting to instrument's firing output even if duration of square wave initial pulse is improperly long thanks to probe damage prevention circuit automatically limiting energy transmitted to probe's crystal
  • 46 dB dynamic range 20 dB/µs maximum slope multiple curve DAC/TCG may be created using up to 40 data points to correct distance – amplitude variations of ultrasonic signals
  • Both theoretical and experimental DAC may be activated either through keying in dB/mm (dB/") factor or through sequential recording echo amplitudes from variously located equal reflectors
  • DAC/TCG may be applied to rectified A-Scans (positive, negative, and full wave) and to RF A-Scans as well
  • Built-in DGS data base for standard probes is unlimitedly expandable
  • Thanks to extended dynamic range signals significantly exceeding the A-Scan height (up to 199.9%) may be evaluated without dropping instrument Gain
  • Whilst A-Scan is frozen managing of Gain and Gates settings is still allowed and provides bringing signals to necessary evaluation level and performing required evaluation
  • Dual Ultrasound Velocity Measurement Mode extremely simplifies resolving of sound path distances for dissimilar materials adjacent to each other whereas different values of ultrasound velocity are valid for corresponding signals appearing on the same A-Scan
  • RF display mode combined with frequency domain signal analysis enhances capabilities of the instrument for materials characterization, bond inspection, testing of dissimilar materials, defect pattern analysis, and probes evaluation
  • Optional data logger organizes and manages database files capable to store up to 254745 thickness readings each and organized as 2D matrix. In database every thickness reading is accompanied with corresponding raw data A-Scan and instrument setup. Automatic creating of MS Excel® thickness spreadsheet meets requirements of various Risk Based Inspection and Maintenance (RBIM) procedures
  • And more… see technical data page

　

Thickness Profile imaging and recording is performed through continuous capturing of thickness readings along probe trace:
　

  • Both time-based (real time clock) and true-to-location (built-in incremental encoder interface) mode of data recording are supported

  • Complete sequence of A-Scans is recorded along with thickness profile

  • Off-line evaluation of thickness profile record is featured with:

    • Sizing of thickness damages at any location along stored image: remaining thickness, thickness loss, and length of damage

    • Play-back and evaluation of A-Scans obtained during scanning

    • Off-line reconstruction of thickness profile image for various Gain and/or Gate settings

    • Automatic conversion of thickness profile B-Scan data into MS Excel® thickness spreadsheet meeting requirements of various Risk Based 檢測and Maintenance (RBIM) procedures


Typical Application: Corrosion characterization

 For Thickness Profile imaging movie example   

On-Line

Off-Line

缺陷的B-Scan斷層影像以及記錄，利用長波以及切變波做檢測，經由持續的量測回音振幅以及沿著探頭軌跡的反射器座標：
　

  • Both time-based (real time clock) and true-to-location (built-in incremental encoder interface) mode of data recording are supported

  • Complete sequence of A-Scans is recorded along with B-Scan defects images

  • Off-line evaluation of B-Scan record is featured with:

    • Sizing of defects at any location along stored image -coordinates and projection dimensions

    • Play-back and evaluation of A-Scans obtained during scanning

    • Defects outlining and echo-dynamic pattern

    • Reconstruction of the B-Scan defects images for the various Gain and/or Reject settings

    • DAC / DGS B-Scan normalization


Typical Applications: Pulse echo 檢測of welds, composites, metals, plastics, and the like

For B-Scan cross-sectional imaging movie example click here  

On-Line

Off-Line

Line Scanning XY Scanning

對缺陷做切變波、表面波、導波檢測的CB-Scan 垂直平面檢視成像 以及記錄，透過持續的量測回音振幅以及沿著探頭軌跡的反射器座標:

  • Both time-based (real time clock) and true-to-location (built-in incremental encoder interface) mode of data recording are supported

  • Complete sequence of A-Scans is recorded along with CB-Scan defects images

  • Off-line evaluation of CB-Scan record is featured with:

    • Sizing of defects at any location along stored image -coordinates and projection dimensions

    • Play-back and evaluation of A-Scans obtained during scanning

    • Defects outlining and echo-dynamic pattern

    • Reconstruction of CB-Scan defects images for various Gain and/or Reject settings

    • DAC/DGS CB-Scan normalization


Typical Applications: Long range pulse echo and CHIME 檢測of the annular plates and pipes, for pitting, stress corrosion, etc; weld inspection, surface wave 檢測


 CB-Scan 垂直平面檢視成像影片範例請按此連結 

在線

離線

CB-Scan imaging of volume under test aside of narrow scanning area is performed through continuous measuring and recording of echo amplitudes, reflectors coordinates, and probe swiveling angle during XY probe manipulating:
　

  • True-to-location data recording is provided through mechanics free airborne ultrasound determining of probe location and swiveling angle

  • Complete sequence of A-Scans is recorded along with real time CB_Scan imaging

  • Off-line evaluation of captured CB-Scan Images and A-Scan distribution data is featured with:

    • Sizing of defects at any location of scanned volume: coordinates, XY projection dimensions, and area

    • Play-back and evaluation of A-Scans obtained during scanning;echo-dynamic pattern analysis

    • CB-Scan image reconstruction for various Gain and/or Reject settings

Typical Application:

Flaw detection and corrosion screening using guided and surface waves; defect outlining using angle beam probes

　

On-Line

Off-Line

TOFD 檢測-RF B-Scan以及 D-Scan成像

  • Both time-based (real time clock) and true-to-location (built-in incremental encoder interface and mechanics free airborne ultrasound encoder) mode of data recording are supported

  • Averaging A-Scans whilst recording as per operator's selection

  • Complete sequence of RF A-Scans is recorded along with TOFD map

  • Off-line evaluation of TOFD Map is featured with:

    • Improvement of near to surface resolution through removal of lateral wave and/or back echo record

    • Linearization and straightening

    • Increasing contrast of TOFD images through varying Gain setting and/or rectification

    • Defects pattern analysis and sizing

    • Zoom of TOFD Map and A-Scans


Typical Applications: weld inspection; CHIME inspection
TOFD 檢測影像實例，請按此連結　
在線

離線

離線

　

Corrosion (thickness) mapping is performed through continuous measuring and recording of wall thickness data during XY scanning

  • True-to-location data recording is provided through mechanics free airborne ultrasound determining of probe location on planar and curved surfaces

  • Complete sequence of A-Scans is recorded along with real time back wall surface rendering

  • Off-line evaluation of captured XY wall thickness and A-Scan distribution data is featured with:

    • Sizing of thickness damages at any location of scanned surface: remaining thickness, thickness loss, XY dimensions, and area of damage

    • Play-back and evaluation of A-Scans obtained during scanning

    • Back wall surface profile reconstruction for various Gain and/or Gate settings

    • Statistical analysis of XY wall thickness distribution data and its conversion into MS Excel® spreadsheet compatible with various Risk Based 檢測and Maintenance (RBIM) procedures

Typical Application:

Corrosion detection and characterization

For movie illustrating principles of corrosion mapping click here

For movie illustrating corrosion mapping example click here

　

　

垂直光束檢測以及立體資料呈現 (B-, C-, and D-Scan)是在XY掃描中透過持續回音振幅以及反射器座標的量測和記錄：
　

  • True-to-location data recording is provided through mechanics free airborne ultrasound determining of probe location on planar and curved surfaces

  • Complete sequence of A-Scans is recorded along with real time B-, C-, and D-Scan imaging

  • Off-line evaluation of captured B-, C-, and D-Scan images and A-Scan distribution data is featured with:

    • Sizing of defects at any location of scanned volume: coordinates, XY projection dimensions, and area

    • Play-back and evaluation of A-Scans obtained during scanning; echo-dynamic pattern analysis

    • B-, C-, and D-Scan image reconstruction for various Gain and/or Gate and/or Reject settings

    • Slicing of C-Scan and D-Scan images

    • Statistical analysis of B-, C-, and D-Scan image and its conversion into MS Excel® spreadsheet compatible with various Risk Based 檢測and Maintenance (RBIM) procedures

Typical Applications:

Weld and base metal angle beam inspection

For movie illustrating principles of straight beam 檢測with 3D data presentation click here

　

　

Angle beam inspection with 3D data presentation (P-, D-, and B-Scan) is performed through continuous measuring and recording of echo amplitudes, reflectors coordinates, and probe swiveling angle during XY scanning:

　

  • True-to-location data recording is provided through mechanics free airborne ultrasound determining of probe location on planar and curved surfaces

  • Complete sequence of A-Scans is recorded along with real time P-, D-, and B-Scan imaging

  • Off-line evaluation of captured P-, D-, and B-Scan images and A-Scan distribution data is featured with:

    • Sizing of defects at any location of scanned volume: coordinates, XY projection dimensions, and area

    • Play-back and evaluation of A-Scans obtained during scanning; echo-dynamic pattern analysis

    • B-, C-, and D-Scan image reconstruction for various Gain and/or Reject settings

    • Slicing of P-Scan and D-Scan images

Typical Application:

Weld and base metal angle beam inspection

For movie illustrating principles of weld 檢測and imaging click here